Edge-Connect SBC, ADLE3800SEC

Edge-Connect Architecture Overview

This ultra-compact form factor is designed as full-featured, flexible expansion SBC for rugged, embedded applications.

The Edge-Connect architecture allows for added I/O expansion and connectors in a variety of baseboard/breakout board configurations (flat, vertical, odd-shapes, etc.) for applications including:

  • Secure networking, secure routing, traffic monitoring and gateways, cyber security edge devices for ICS and SCADA threat security
  • Unmanned drone/robotics (air, surface, underwater) for leak detection, security, agriculture, science research and datalogging in a variety of rugged environments
  • Wearable computing – especially in rugged military or industrial environments
  • Portable healthcare instrumentation

Low Profile Horizontal Expansion                Small Footprint Vertical Expansion

         Low Profile Horizontal Expansion                       Small Footprint Vertical Expansion

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Edge-Connect Items & Descriptions

Item Codes

  • ADLE3900SEC
    • Compact size (75mm x 75mm)
    • Low power Intel E3900-Series Atom® processors (formerly codenamed Apollo Lake)
    • 4K resolution at 60 Hz of DisplayPort video output
    • 15 Year Availability
    • Rugged, Soldered 4GB DDR4 Memory
    • Option: -40C to 85C Screening
    • COTS and Custom Expansion Options via Backside Expansion Connector
  • ADL120S
    • Compact 120mm x 120mm footprint
    • 6th Generation Intel® Core™ Processors (formerly codenamed Skylake)
    • Intel® Q170 Chipset
    • Long-term available Intel embedded processors
    • 8x Stackable Expansion PCIe lanes with up to 4x SATA and/or 4x USB3.0
    • Up to 32GB DDR4
    • Operating Temperature: -20-70C Standard; -40C to 85C Option
  • ADLE3800SEC
    • Small Size (75mm x 75mm)
    • 4GB soldered DRAM (DDR3-1333 Mhz)
    • Low power Atom® processor (8W TDP)
    • Quad-Core / Dual Core Versions available
    • M.2 Storage Socket Onboard
    • Edge-Connector Expansion
    • Microsoft Azure Certified for loT
Item Code Description
ADLE3900SEC

 
  • Compact 75mm x 75mm footprint
  • Low power Intel E3900-Series Atom® processors (formerly codenamed Apollo Lake)
  • 4K resolution at 60 Hz of DisplayPort video output
  • 15 Year Availability
  • Rugged, soldered 4GB DDR4 Memory
  • Option: -40C to 85C screening
  • Industrial-grade Power Galvanic Isolation
  • COTS and Custom Expansion Options via Backside Expansion Connector
  • Firmware TPM 2.0
  • Windows 10 and Linux compatible
ADL120S
END OF LIFE (EOL)
Contact us for product availability
Replacement model: ADLQ170CE
  • Compact 120mm x 120mm footprint
  • 6th Generation Intel® Core™ Processors (Formerly Codenamed Skylake)
  • Intel® Q170 Chipset
  • Long-term available Intel embedded processors
  • 8x Stackable Expansion PCIe lanes with up to 4x SATA and/or 4x USB3.0
  • Up to 32GB DDR4
  • Operating Temperature: -20-70C Standard; -40C to 85C Option
  • 4x USB 3.0
  • 4x Gbit/s LAN
  • Windows and Linux compatible
ADLE3800SEC

 

Microsoft Azure Certified
  • Small Size (75mm x 75mm)
  • 4GB soldered DRAM (DDR3-1333 Mhz)
  • Low power Atom® processor (8W TDP)
  • Quad-Core / Dual Core Versions Available
  • M.2 Storage Socket Onboard
  • Edge-Connector Expansion
  • Extended Temperature Available
  • Windows 7, Windows 8, Windows 10, Linux Compatible
  • Supports up to 2 additional PCIe devices (requires expansion card)
  • Microsoft Azure Certified for loT